The new processors, which are expected to be based on TSMC’s 3nm manufacturing technology, may come with up to 40 cores in different chip dies.
With its M1 series SoCs, Apple has managed to build a family of chips that can compete against the vast majority of AMD and Intel’s top CPUs. The tech giant is now developing three different 3nm chips, codenamed Ibiza, Lobos and Palma, to launch in 2023.
According to The Information, Apple plans to release its 2nd generation M-series SoCs (maybe M2) for Mac computers next year. These processors will be made using an enhanced version of TSMC’s N5 (5nm) node currently used to make Apple’s M1 series SoCs (N5P, N4 and N4P). Therefore, we can expect improvements in terms of performance and transistor count.
More importantly, Apple is said to be working on developing a processor with a multi-chip module to achieve higher performance in powerful systems like the MacBook Pro 16. However, since these processors are manufactured using TSMC’s N3 (3nm) class manufacturing process, the company is likely to make much more tangible improvements to its 3rd generation M-series SoCs. The Taiwanese giant’s new technology will help Apple fit significantly more transistors and increase frequency speeds without increasing power consumption.
The alleged Apple M3 lineup reportedly includes processors codenamed Ibiza, Lobos, and Palma. Each of these will target different Mac systems based on their performance requirements. High-end processors are said to offer up to 40 CPU cores on four dies, which will provide enough power for workstations like the Mac Pro.
According to the report, the first M3 chips will be released in 2023. As you know, TSMC’s leading technologies are usually first used by Apple, and we already know that the semiconductor giant will mass produce 3nm technology in 2023.